Samsung and Micron launch Consortium to Break Down the Memory Wall


Samsung and Micron — world leaders in memory technology — today announced the creation of a consortium for OEMs, enablers and integrators that will collaborate in developing and implementing an open interface specification for an innovative new memory technology called the Hybrid Memory Cube (HMC). HMC capabilities are a leap beyond current and near-term memory architectures in the areas of performance, packaging and design efficiencies. By defining an industry interface specification for developers, manufacturers and architects, the consortium is committed to making HMC a successful new high-performance memory technology.The consortium will initially define a specification to enable applications ranging from large-scale networking to industrial products and high-performance computing.


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HMC could lead to unprecedented levels of memory performance and facilitate new applications in networking, medical, energy, wireless communications, transportation, security and other markets. Micron and Samsung are the founding members of the Hybrid Memory Cube Consortium (HMCC), and will work closely with fellow developers Altera Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate industry efforts in bringing to market a broad set of technologies.
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