})(jQuery);

VIA launches VIA AMOS-5001 Chassis Kit for Slim Em-ITX Embedded Systems


VIA today announced the VIA AMOS-5001, a specially designed chassis kit for Em-ITX form factor boards enabling the rapid and easy assembly of a wide variety of robust fanless embedded system designs. The VIA AMOS-5001 chassis kit features a unique modular design comprised of only four mechanical parts that ensures the easy integration of VIA EITX-3001 series mainboards. The VIA AMOS-5001 chassis combines with the unique integrated heatsink design found on Em-ITX boards. The discrete aluminum heatsink has direct contact with the processor and chipset on reverse side of the board, forming a solid, robust base for chassis assembly. An optional storage compartment can also be added. An optional 2.5” HDD storage subsystem chassis is also available.


VIA_AMOS_5001_inside.jpg
Measuring just 35.2mm high and 231mm wide, the ultra-compact VIA AMOS-5001 is slim enough to fit in even the most space-constrained environment. Systems built using the VIA AMOS-5001 are also shock resistant and can withstand even the most extreme temperatures. The VIA AMOS-5001 is available now and is targeted at a wide variety of embedded segments including medical, POI/POS, digital signage, kiosk, industrial and building automation, and gaming and surveillance applications.