NTT DoCoMo Develops Low-Power LSI Chip for Super 3G

NTT DoCoMo has developed and successfully tested a trial large-scale-integration (LSI) chip incorporating advanced power-saving signal-processing technologies that enable the chip to work at a sufficiently low power consumption and to be made small enough to fit into forthcoming Super 3G (will provide superfast downlinks in excess of 100Mbps) handsets and beyond. In the test, DoCoMo’s LSI achieved a transmission rate of 200Mbps with high precision over a high-speed wireless network, while power consumption did not exceed 0.1W thanks to DoCoMo’s proprietary signal-processing technology.

Redundant circuits have been eliminated in the experimental chip, which was made with 65 nanometer processing.

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