MediaTek and AMD announced a collaboration to co-engineer industry leading Wi-Fi solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals. To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe and USB interfaces for modern sleep states and power management.
MediaTek’s new Filogic 330P chipset supports the latest connectivity standards of 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz), along with Bluetooth 5.2 (BT/BLE). The high throughput chipset is ultra-fast with support for up to 2.4Gbps connectivity, including support for the new 6GHz spectrum at 160MHz channel bandwidth. The chipset also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint which enables the Filogic 330P chipset to be embedded in laptops of all sizes.
