OCZ today launched the OCZ PC3-12800 Flex XLC kit. This high-speed DDR3 solution features the industry’s most unique and powerful cooling capability on the market. Intended for the extreme enthusiast looking for the absolute highest performance, the new Flex XLC delivers unprecedented speed and thermal management to cool the modules for optimal stability and longevity. The newest OCZ PC3-12800 modules feature OCZ’s Flex XLC (Xtreme Liquid Convention) heatsink that delivers superior heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. This unique “flexible” design gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation, allowing the memory to operate at extreme speeds without the high temperatures that inhibit or damage the module’s ICs.
With the ideal balance of sheer DDR3speed and excellent latency, coupled with the award-winning Flex XLC technology, the OCZ PC3-12800 modules run at a blazing 1600MHz and feature 6-6-6-18 timings to maximize the performance potential of the latest Intel-based motherboards. The OCZ PC3-12800 Flex XLC modules are optimized for the premier DDR3 platforms and will be available in 2GB (2x1024MB) dual channel kits.
