OCZ Technology Memory Modules with Sophisticated Passive Cooling Solution
OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, unveiled the OCZ PC2-8500 Reaper HPC Series. This 2GB dual channel kit features the proprietary OCZ Reaper HPC (Heat Pipe Conduit) heatspreader, engineered to deliver superior silent heat dissipation over traditional heat spreaders. The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved over clocking performance, while improving longevity and stability of the modules. The first modules to be incorporated with the new Reaper heatsink are rated at 1066MHz and run at CL 5-5-5.
Featuring an EPP (Enhanced Performance Profiles) programmed SPD, PC2-8500 Reaper HPC modules will immediately boot at the rated specs on the latest generation of NVIDIA SLI chipsets. The PC2-8500 Reaper HPC series will be available in 2GB (2x1024MB) dual channel kits.