NVIDIA today announced a multi-year collaboration with Microsoft to build one of the most powerful AI supercomputers in the world, powered by Microsoft Azure’s advanced supercomputing infrastructure combined with NVIDIA GPUs, networking..
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Sony today announced the launch of the SFA – Life Sciences Cloud Platform, a flow cytometry data analysis cloud solution that can quickly identify rare cells, such as cancer cells and stem..
The supercomputer Fugaku, jointly developed by RIKEN and Fujitsu, has successfully retained the top spot for six consecutive terms in multiple major high-performance computer rankings including HPCG and Graph500 BFS (Breadth-First Search),..
Fujitsu today announced the development of quantum/HPC hybrid computing technology to optimize workload selection for customers. The new AI-based software, which serves as a precursor to a future computer workload broker technology,..
Thermaltake recently announced their latest addition to the PSU lineups, the Toughpower SFX series. The Toughpower SFX series is fully modular and compatible with Intel’s ATX 3.0 specifications, which allows users to..
Asus today announced the much-anticipated Zenbook 17 Fold OLED model UX9702, while uncovering its inspiration, design story, specifications, pricing and availability during its Zenbook 17 Fold OLED virtual launch event and The..
Gigabyte announces today the latest AORUS Gen5 10000 SSD with 10GB/s read speed. Enhanced by the new generation PCIe 5.0 controller with ultra-fast 3D-TLC NAND Flash, AORUS Gen5 10000 SSD provides boosted..
MSI today updated its Prestige series lineup with new Prestige 16 and Prestige 16 EVO. Available in Urban Silver color, Prestige 16 and Prestige 16 EVO are equipped with Intel 12th Gen..
XPG today announced their new HURRICANE ARGB PWM cooling fans. This new line comes in both 120mm and 140mm sizes and It was built for users that require top cooling performance without..
SK Hynix today announced that it has developed its first DDR5 DRAM-based CXL (Compute Express Link) memory samples and strengthened its presence in next-generation memory solutions market. The form factor of the..
