SAMSUNG Electronics Develops 16-Chip Multi-Stack Package Technology
Samsung Electronics Co., Ltd. has developed the industry’s first process to enable innovative production of a 16-chip multi-chip package (MCP) of memory. The new MCP technology supports the industry-wide demand for small form factors and high-densities that will accommodate multimedia-intensive user applications. Samsung’s new 16-chip MCP technology, when applied to 8 GB NAND flash chips, can enable up to a 16 gigabyte (GB) MCP solution. For the new 16-chip process, Samsung introduced wafer-thinning technology that eliminates 24 over 25 (24/25) of the thickness of each fabricated-wafer to reduce the overall thickness to only 30-micrometers (㎛). This is just 65 percent the thickness of the 10-chip MCP wafer (45㎛) Samsung developed in 2005 and similar to the size a human cell, which measures 20 to 30㎛. Samsung also developed a new laser-cutting technology to cut the wafer into individual chips.
This new cutting process prevents the memory chips from breaking into pieces when they are cut using conventional blade sawing technology, which was originally designed only for sawing wafers up to 80㎛-thick. The new Samsung16-chip MCP package technology provides the highest density solution yet developed for the creation of slimmer consumer electronics, in response to the increasing demand for more multimedia features in mobile devices.