Super Talent green DDR3 modules uses 38% less PCB material and 47% less packaging material
Super Talent has developed a new line of green DDR3 modules that use 38% less PCB material and 47% less packaging material than the company’s standard DDR3 DIMMs. In this product line Super Talent has taken two major steps toward developing more eco-friendly DRAM. Using JEDEC standard schematics Super Talent developed very low profile (VLP) DDR3 unbuffered DIMMs for use in standard DDR3 based x86 motherboards. These DIMMs use 38% less FR4 material, which is the fiber glass epoxy substrate most PCBs are made of, and one-third less copper.
Super Talent redesigned their package for these green DIMMs to use about half as much plastic in a clamshell that occupies 57% less volume. These reductions in material usage result in a packaged module that weighs 35% less than a standard DDR3 packaged DIMM, which translates to significant savings in shipping costs. Super Talent’s first green 1066 and 1333 MHz 1GB and 2GB DIMMs will begin shipping in September.