Thermaltake is planning to introduce two new full tower chassis this October, the Xaser VI and the Armor+.The innovative designs provide independent thermal solution for VGA, CPU and HDD section, while the cable management design improve internal airflow and enhance overall thermal management. Following the design concept of sport cars, users can expect new aesthetic experiences from Xaser VI and Armor+. The top sliding hood allows easy access to the extra storage space for small tools and accessories. Internally, the PSU supporting bridge, removable HDD cage and motherboard tray have all been re-designed to achieve smarter and easier installation process. In order to allow enthusiasts to be the trend setters with Thermaltake creations, Xaser VI and Armor+ will be the only case in the market that equip with 10 PCI slot and 14 drive bay to support extreme expandability and user friendliness.
Further more, the liquid-cooling models of Xaser VI and Armor+ will be released before the end of 2007. This time, technological breakthrough had not only solved the annoying space-consuming and maintenance complexity problems of liquid-cooling systems; but the top sliding hood also will provide extreme convenience for an internal liquid cooling system maintenance that has never been achieved before.
