Toshiba announces world’s first largest density 32GB embedded NAND flash memory modules

Toshiba__nand_flash.jpg
Toshiba today announced the launch of 32GB embedded NAND flash memory modules that offer the largest density yet announced plus full compliance with the e-MMCTM and eSDTM standards. The embedded devices are designed for application in mobile digital consumer products, including mobile phones and video cameras. The new Toshiba 32GB embedded devices combine eight 32Gbit (=4GB) NAND chips fabricated with Toshiba’s cutting-edge 43nm process technology and also integrate a dedicated controller. The new Toshiba 32GB embedded devices supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.
Press Release after the jump


Toshiba_32gb_nand_flash.jpg
Samples will be available in September 2008, and mass production will start in the fourth quarter.
TOKYO–Toshiba Corporation (TOKYO:6502) today announced the launch of 32GB embedded NAND flash memory modules that offer the largest density yet announced plus full compliance with the e-MMCTM(1) and eSDTM(2) standards. The embedded devices are designed for application in mobile digital consumer products, including mobile phones and video cameras. Samples will be available in September 2008, and mass production will start in the fourth quarter.
The new 32GB embedded devices combine eight 32Gbit (=4GB) NAND chips fabricated with Toshiba’s cutting-edge 43nm process technology and also integrate a dedicated controller. Full compliance with JEDEC/MMCA Ver 4.3 and SDA Ver 2.0, high speed memory standards for memory cards as defined by the MultiMediaCard Association and SD Card Association, respectively, supports standard interfacing and simplified embedding in products, reducing development burdens on product manufacturers.
Toshiba offers a line-up of single-package embedded NAND Flash memories which include a controller to manage basic control functions for NAND applications: LBA-NANDTM(3) memory, which has a NAND interface; eSD large capacity chips with SD interface; and e-MMC with an HS-MMC interface. This comprehensive line-up, available in densities ranging from 1GB to 32GB, supports application in a very wide range of products.
There is growing demand for memories with a controller function that minimizes development requirements and eases integration into system designs. Toshiba has already taken steps to secure leadership in this expanding market, and the addition of higher density modules will reinforce the company’s position.