Toshiba’s Dynastron series of CMOS image sensors, an ultra small CSCM (chip scale camera module) will be the first camera module manufactured with TCV (Through Chip Via) technology. Mass production of new products will start at Iwate Toshiba Electronics, a Toshiba Group company, from January 2008. The new Toshiba CSCM micro-camera modules will be the first produced with TCV technology, which reduces wire bonding a substrate area by mounting components directly on the wafer and running electrodes through the vias on the circuit board, securing them with balls of solders on the substrate. The new product also reduces pixel size, contributing to a module size up to 64% smaller than camera modules manufactured with the same sensors.
The application of balls of solder and heat resistant lenses that are not affected by reflow significantly reduces the process for camera mounting to the circuit boards of mobile consumer products manufacturers.The modules will be demonstrated at CEATEC JAPAN 2007 from October 2nd, at Makuhari Messe, at Toshiba’s booth, at 8C12.
