Samsung Electronics Co., Ltd. announced the world’s first 3-megapixel (M-pixel) CMOS image sensor (CIS) with a 1/4-inch lens aperture that is well suited for ultra slim camera phones. Samsung’s 1.75um-pixel, 1/4-inch lens aperture 3M-pixel CIS is a unique combination of Samsung’s high resolution sensor technology and high speed serial interface that brings digital still camera-level picture quality to mobile handsets. The new CIS chip provides a small form factor and high picture quality. Samsung’s new 1.75um-size pixel enables the 1/4-inch lens aperture to drastically reduce the camera module size by 30 percent as opposed to a conventional 2.25um pixel 1/3-inch lens aperture 3M-pixel CIS.
By utilizing 90-nanometer (nm) process technology, Samsung expects to mass produce the new 1.75um pixel, 1/4-inch lens aperture 3-Mp CIS in the first quarter of 2007.
