NEC Electronics Corporation today introduced the M2 system LSI chip that integrates third generation (3G to 3.5G) W-CDMA and HSDPA communications technologies with application functions, with advanced low power technologies optimized for mobile handsets. The chip utilizes a 3.5G digital baseband (DBB) technology developed by Adcore-Tech.
Samples of the M2 chip are available now priced at US$45. Volume production is scheduled to begin in October 2007, and reach approximately 1 million units per month by 2008.
