Samsung is now mass producing the industries first ePoP (embedded package on package) memory – a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card) and a controller. For use in high-end smartphones, the extremely thin Samsung ePoP combines all essential memory components into a single package that can be stacked directly on top of the mobile processor, without taking any additional space – a distinct improvement over existing two-package eMCP memory solutions.
The new Samsung ePoP provides an ideal one-package memory solution, satisfying the market needs for high speed, high energy efficiency and compactness. The 3GB LPDDR3 mobile DRAM inside the ePoP operates at an I/O data transfer rate of 1,866Mb/s, and sports a 64-bit I/O bandwidth. The Samsung ePoP memory saves a significant amount of space, enabling smartphone manufacturers to use the space for components like the battery pack. The new configuration for phones can be easily customized not only for use in flagship smartphones but also in other sophisticated mobile devices such as high-end tablets, in collaboration with global mobile companies.
