Sony and Tokyo Tech Jointly develop Low-power LSIs for Wideband Millimeter-wave Wireless Communications
Sony today announced that Tokyo Tech and Sony have jointly developed a radio frequency (“RF”) LSI and a baseband (“BB”) LSI that enables millimeter-wave wireless data transfer at the world’s fastest rate of 6.3 Gb/s. In this joint development, Sony was tasked with designing the digital parts of the BB LSI and the development of the chip unit as a whole, while the Tokyo Institute of Technology designed the RF LSI and the analog parts of BB LSI. Implementation of this technology will enable users to transmit and receive data at much higher speeds between mobile devices without the need for cable connections. This technology will also enable users to enjoy uncompressed high-quality video streaming from a mobile device to a display.
The high-efficiency and high-integrity of the rate-14/15 Low-Density Parity-Check (LDPC) error-correcting code developed by Sony significantly decreases the amount of redundant data that is required for error correction, and this has enabled LDPC decoding at the world’s lowest per-bit energy efficiency of 11.8 pJ/b (74 mW at 6.3 Gb/s). This LDPC code was proposed to the 60 GHz band millimeter-wave wireless communication standard IEEE 802.15.3c and employed in the standards.