Toshiba has developed the world’s smallest wireless communication module and thinnest flexible printed circuit (FPC) coupler compatible with TransferJet– the close-proximity wireless transfer technology. In combination and applied to mobile devices, such as smartphones, they achieve a maximum data transfer rate of 375Mbps. Toshiba’s small module, only 4.8mm x 4.8mm x 1.0mm, and ultra-thin FPC coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate of 522Mbps (effective data transfer rate of 375Mbps). Module miniaturization was realized by employing 3D integration technology to embed a TransferJet -compatible LSI in the module substrate. Such embedding usually requires a higher module to maintain performance, but Toshiba’s advanced design capabilities enabled it to secure a low module with excellent performance.
The new thin FPC coupler is fabricated with an innovative process that uses molecular bonding technology. The new FPC coupler is fabricated with molecular bonding technology, which secures enough adhesion of FPC by covalent bond of a thin molecular layer. The coupler is electrically evaluated with the module and excellent transmission RF signals have been observed. It has quarter thickness of conventional couplers. This module and coupler are ideal for small, thin mobile devices, and Toshiba expects them to be widely adopted.
