Sony today announced the launch of a new beamforming microphone, MAS-A100, an advanced audio solution to enable flexible and creative “hands-free” lectures and presentations. The Sony MAS-A100 achieves hands-free speech reinforcement without..
Panasonic announced today that it has succeeded in demonstrating the world’s highest brightness blue laser. Panasonic achieved by using the wavelength beam combining (WBC) technology on a direct diode laser (DDL) to..
Yamaha Motor today announced that YRM20 Premium High-Efficiency Surface Mounter will be launched on April 1, 2020. Built on an all-new next-generation platform which embodies the intelligent factory, the high-efficiency YRM20 Premium..
Mitsubishi Electric Chosen as Prime Contractor of the New Satellite for Innovative Satellite Technology Demonstration-2
Mitsubishi Electric has been designated by the Japan Aerospace Exploration Agency (JAXA) as the prime contractor of the new satellite for Innovative Satellite Technology Demonstration-2. Innovative Satellite Technology Demonstration-2 is a part..
A Japanese research group has developed a method that increases the accuracy of predicting long-term seawater temperatures by collecting data with the help of turtles. Researchers from the Japan Agency for Marine-Earth..
A snow crab caught in Tottori Prefecture in Japan attracted the highest-ever bid for a crab at auction of 5 million yen ($45,883). The Itsukiboshi high-end crab weighing 1.24 kilograms with a..
For 28 years the words Honda Fireblade have been synonymous with perfect handling, balance and sheer riding enjoyment. For 2020, Honda starts a new chapter in the Fireblade’s illustrious history with a..
Olympus SLIDEVIEW VS200 Research Slide Scanner Offers Easy-to-Operate High-Resolution Data Acquisition
Olympus announced today the launch of the SLIDEVIEW VS200 solution, a research slide scanner that captures high-quality virtual slide images and enables advanced quantitative image analysis for brain, cancer and stem cell..
Samsung today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of..