Akita Elpida Memory, Inc. announced the successful development of a 1.4 mm thick Multi Chip Package (MCP) with 20 stacked dies, making it the world’s thinnest. As portable devices such as mobile phones and digital still cameras become even thinner and more compact as well as more highly functional, demands are being made for greater sophistication of semiconductor products such as flash memories, DRAMs, and logic which bring these features into reality. Akita Elpida plans to put this package technology to work to establish high-yield and low-cost manufacturing technology for multi-chip stacked packages such as existing 5- and 7-die multi-chip stacked packages, thereby doing their utmost to expand their business.
Moreover, Akita Elpida plan to team up with equipment manufacturers as well as those of materials to aggressively develop state-of-the-art, highly value-added packages and related manufacturing technology as they respond to customer and market demands .Elpida Memory, Inc. is a leading manufacturer of Dynamic Random Access Memory (DRAM) silicon chips.
