Samsung Electro-Mechanics Co. Ltd. will initiate mass production of light emitting diodes (LEDs) using 4-inch wafer. A single sheet of 2-inch wafer that is adopted by most market players can be cut into 15,000 LED chips, while the 4-inch wafer can be cut into more than 60,000 units, resulting in a four-time higher productivity. The company has almost completed the installation of 4-inch wafer plant equipment, and plans to start testing for LED production by the end of the year and move into mass production using 4-inch wafer from next year.
In addition Samsung Electro-Mechanics Co. Ltd is set to proceed with an additional massive investment in packaging in the near future, in an effort to accomplish an economy of scale and the resultant competitiveness enhancement.
