TDK has developed three types of MMZ1005-E Gigaspira multilayer gigahertz band chip bead product with the industry’s highest impedance. In recent years, mobile devices such as mobile phones have incorporated numerous advanced functions in addition to standard talk functions such as terrestrial digital broadcast and FM broadcast reception and GPS functions. When they are used, each of these functions requires a different signal, and if radiated noise affects the reception antenna or high-frequency circuit units, reception sensitivity can deteriorate. Consequently, it is necessary to efficiently eliminate noise from high-density mounted circuits and isolate each signal. To respond to these market needs, TDK developed three high-impedance products that can efficiently eliminate noise over a wide band using a single chip.
Mass Production of Three New Gigaspira Multilayer Bead Products is scheduled to begin in June. These products were developed using original multilayer structure technologies and ferrite material technologies, successfully raising the impedance and adding to TDK’s lineup of products suitable for eliminating noise over a wide band in the gigahertz range.
