For 28 years the words Honda Fireblade have been synonymous with perfect handling, balance and sheer riding enjoyment. For 2020, Honda starts a new chapter in the Fireblade’s illustrious history with a..
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Olympus announced today the launch of the SLIDEVIEW VS200 solution, a research slide scanner that captures high-quality virtual slide images and enables advanced quantitative image analysis for brain, cancer and stem cell..
Fujitsu today announced the development of new “Content-Aware Computing” technology that can control accuracy while increasing computing speeds. The technology was developed in response to the increasing demand for computing power accompanying..
Fujifilm today announced the launch of the FUJIFILM X-Pro3 (X-Pro3), the latest flagship model for the X Series lineup of compact and lightweight mirrorless digital cameras. The X-Pro3 is the first Fujifilm..
Honda today held the world premiere of the all-new Fit at the 46th Tokyo Motor Show 2019 (show (Press days: October 23-24, Public days: October 25 – November 4, 2019) and it..
Samsung Flip 2 is an interactive display that simplifies teamwork without any hassle. With the Flip 2, user can create freely thanks to a smooth pen-to-paper-like writing experience. Ideas flow through smooth..
Mitsubishi Electric’s newly developed KOTSUMON system uses its Maisart artificial-intelligence (AI) technologies to extract video data for the automatic identification and analysis of specific types of human motions, such as those of..
Panasonic today announced a palm-sized wireless speaker Kyo-zutsu that brings to life an enriching listening experience. Panasonic co-developed Kyo-zutsu with Kaikado, a long-established maker of handmade tea caddies based in Kyoto. A..
Nikon today introduces the Nikon Z 50, the first Z series DX-format mirrorless camera. Nikon Z 50 inherits its design and operability, reliability, and future possibilities as a mirrorless system from the..
Samsung today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of..
