Samsung today introduced Samsung ISOCELL GN1, a new 50-megapixel (Mp) image sensor with large 1.2μm-sized pixels. The ISOCELL GN1 is Samsung’s first image sensor to offer both Dual Pixel and Tetracell technologies…
Tag Archives: Samsung
Samsung today introduced a new lineup of the Samsung Jet cordless stick vacuum cleaner, along with a compatible Clean Station that can deliver the ultimate end-to-end cleaning solution for the home. The..
Samsung today unveiled its first human-centric LED packages, collectively known as LM302N. Engineered with carefully created light spectra, the LM302N family helps human bodies adjust melatonin levels indoors, making people feel more..
Samsung today announced that it has begun mass production of industry’s first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones. Samsung’s 16GB LPDDR5 mobile DRAM package consists of eight 12-gigabit..
Samsung today announced its next-generation 108-megapixel (Mp) image sensor, Samsung ISOCELL Bright HM1. With a spectrum of light-enhancing technologies spanning from Nonacell and Smart-ISO to real-time HDR, ISOCELL Bright HM1 allows brighter..
Samsung today announced the market launch of Flashbolt, its third-generation High Bandwidth Memory 2E (HBM2E). Ready to deliver twice the capacity of the previous-generation 8GB HBM2 Aquabolt , the new Flashbolt sharply..
Samsung today announced the release of its latest external storage device – the Portable Solid State Drive (SSD) T7 Touch – which combines sleek, compact design with the fastest transfer speeds currently..
Samsung and MSC Cruises were awarded for Best Overall Customer Experience from Daily DOOH, a leading industry publication, in recognition of their outstanding innovation in digital signage. Samsung provided interactive touchscreens, digital..
Samsung Flip 2 is an interactive display that simplifies teamwork without any hassle. With the Flip 2, user can create freely thanks to a smooth pen-to-paper-like writing experience. Ideas flow through smooth..
Samsung today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of..
