Mitsubishi Electric has developed the world’s first ultra-wideband transmission chip set with S/C/X-band capability, designed for multi-purpose wireless systems. The new chip set is expected to facilitate the downsizing of transmission modules..
Tag Archives: chip
SK Hynix announced today that it has developed HBM2E DRAM product with the industry’s highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity compared to the previous..
Samsung today announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones. Samsung also..
Samsung today announced two USB Type-C power delivery (PD) controllers, SE8A and MM101. With the new PD controllers, power chargers are able to communicate with the device to deliver the optimum amount..
Samsung today unveiled the world’s largest-capacity Vertical-NAND memory solutions amid growing demand for data-intensive applications across many industries using artificial intelligence and Internet of Things technologies. Samsung showcased 1-terabit V-NAND technology and..
Samsung today announced the newest member of its Exynos family of application processors, the Exynos 8 Octa 8890. This chip is Samsung’s second premium application processor built on 14nm FinFET process technology…
Osram will present the brightest multi-chip LED for the entertainment sector- S32 for the first time at Prolight + Sound 2015. From a technological point of view, S32 is based on LED..
SFH 7050 is the first integrated optical sensor from Osram Opto Semiconductors for automatic fitness tracking. The sensor is used in mobile devices, such as smart watches and fitness armbands, and simplifies..
