Sony Semiconductor Solutions today announced the upcoming release of the IMX611, a direct time-of-flight (dToF) SPAD depth sensor for smartphones that delivers the industry’s highest photon detection efficiency. The Sony bIMX611 has..
Tag Archives: chip
Mitsubishi Electric announced today that it has developed a 200Gbps electro-absorption modulator laser diode (EML) chip. The new chip doubles the speed of the company’s existing 100Gbps EML chip thanks to a..
SK hynix announced today that it has developed PIM, a next-generation memory chip with computing capabilities. PIM(Processing In Memory): A next-generation technology that provides a solution for data congestion issues for AI..
Sony Semiconductor Solutions Corporation today announced the upcoming release of the IMX459 stacked SPAD depth sensor for automotive LiDAR applications using direct Time-of-Flight (dToF) method, an industry first. Sony IMX459 SPAD ToF..
At the annual Hot Chips conference, IBM today unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time…
IBM today announced the development of the world’s first chip with 2 nanometer (nm) nanosheet technology. Demand for increased chip performance and energy efficiency continues to rise, especially in the era of..
Samsung today announced a new automotive LED module optimized for intelligent headlights, such as adaptive driving beam (ADB) systems. ADB is an advanced driver assistance technology designed to help secure maximum driving..
In a joint paper published in Nature Machine Intelligence, researchers from Intel Labs and Cornell University demonstrated the ability of Intel’s neuromorphic research chip, Loihi, to learn and recognize hazardous chemicals in..
Mitsubishi Electric Announces World’s First Ultra-Wideband Transmission Chip set with S/C/X-Band Capability
Mitsubishi Electric has developed the world’s first ultra-wideband transmission chip set with S/C/X-band capability, designed for multi-purpose wireless systems. The new chip set is expected to facilitate the downsizing of transmission modules..
SK Hynix announced today that it has developed HBM2E DRAM product with the industry’s highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity compared to the previous..