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SK Hynix DRAM for AI applications HBM3E can process more than 230 Full-HD movies of 5GB-size each in a second!
SK hynix announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available. Customer’s evaluation of samples is underway. A high-value, high-performance memory that vertically interconnects multiple DRAM chips, enabling a dramatic increase in data processing speed in comparison to earlier DRAM products. HBM3E is the extended version…
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World’s First High Bandwidth Memory 3 From SK hynix Can Process Up to 819GB Per Second
SK hynix today became the first in the industry to successfully develop the High Bandwidth Memory 3, the world’s best-performing DRAM. HBM3, the fourth generation of the HBM technology with a combination of multiple DRAM chips vertically connected, is a high value product that innovatively raises the data processing rate. The latest development, which follows…
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Samsung Launches Industry’s Highest Performing 24G SAS SSD – PM1653
Samsung today announced its launch of the industry’s highest performing 24G SAS (SAS-4) SSD ― the PM1653. Based on the latest SAS interface, the new Samsung drive can support twice the speed of the previous 12G SAS-3 generation. The PM1653 is industry’s first 24G SAS SSD made with sixth-generation (1xx-layer) V-NAND chips, enabling storage capacities…
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Samsung Begins Mass Production of Industry’s First 16GB LPDDR5 DRAM for Next-Generation Premium Smartphones
Samsung today announced that it has begun mass production of industry’s first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones. Samsung’s 16GB LPDDR5 mobile DRAM package consists of eight 12-gigabit (Gb) chips and four 8Gb chips, equipping premium smartphones with twice the DRAM capacity found in many higher-end laptops and gaming PCs today.…
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Samsung Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology
Samsung today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes,…
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Samsung Launches 800-Gigabyte Z-SSD for HPC Systems and AI Applications
Samsung today launched an 800-gigabyte (GB) solid state storage drive—the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis. Developed in 2017, the new 800GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed…
