SK hynix announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available. Customer’s evaluation of samples is underway. A high-value, high-performance memory that vertically..
Tag Archives: chips
SK hynix today became the first in the industry to successfully develop the High Bandwidth Memory 3, the world’s best-performing DRAM. HBM3, the fourth generation of the HBM technology with a combination..
Samsung today announced its launch of the industry’s highest performing 24G SAS (SAS-4) SSD ― the PM1653. Based on the latest SAS interface, the new Samsung drive can support twice the speed..
Samsung today announced that it has begun mass production of industry’s first 16-gigabyte (GB) LPDDR5 mobile DRAM package for next-generation premium smartphones. Samsung’s 16GB LPDDR5 mobile DRAM package consists of eight 12-gigabit..
Samsung today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of..
Samsung today launched an 800-gigabyte (GB) solid state storage drive—the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis. Developed in 2017, the new 800GB Z-SSD provides the..