Sony Semiconductor Solutions Corporation today announced the upcoming release of the IMX459 stacked SPAD depth sensor for automotive LiDAR applications using direct Time-of-Flight (dToF) method, an industry first. Sony IMX459 SPAD ToF..
Tag Archives: circuit
A collaborative research group between the University of Tokyo (lead by Dr. Takao Someya (Dean and Professor of the Graduate School of Engineering) and Dai Nippon Printing has succeeded in producing a..
Samsung today announced the market launch of Flashbolt, its third-generation High Bandwidth Memory 2E (HBM2E). Ready to deliver twice the capacity of the previous-generation 8GB HBM2 Aquabolt , the new Flashbolt sharply..
Oki today announced the launch of its Stretchable Flexible Printed Circuits – Stretchable FPC. The newly launched OKI Stretchable FPC offers elasticity by replacing the polyimide widely used in existing FPCs with..
Mitsubishi Electric has developed a silicon carbide (SiC) power device with what is believed to be the world’s highest power efficiency in a device of its type. The newly-developed unit is designed..
Mitsubishi Electric and Mitsubishi Electric Research Laboratories announced today their development of an ultra-wideband gallium nitride (GaN) Doherty power amplifier for next generation base stations. The new power amplifier is compatible with..
