SK Hynix today announced that it has developed its first DDR5 DRAM-based CXL (Compute Express Link) memory samples and strengthened its presence in next-generation memory solutions market. The form factor of the..
Tag Archives: data
Murata today announced a highly accurate three-in-one soil sensor for data-driven sustainable agriculture. By simultaneously monitoring the electrical conductivity (EC), water content and temperature of the soil, the sensor enables farmers to..
Samsung today announced that it has developed the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung’s advanced sixth-generation V-NAND. PCIe 5.0 offers a bandwidth..
Fujitsu has started joint clinical research with the University of Tokyo Hospital to verify the effectiveness of artificial intelligence technology to estimate abnormal heart movements based on electrocardiogram data. Since December 2019,..
Toshiba has developed the world’s most accurate highly versatile Visual Question Answering (VQA) AI, able to recognize not only people and objects, but also colors, shapes, appearances and background details in images…
Transcend today announced the launch of the SSD250N for NAS. Transcend SSD250N is a 2.5” solid-state drive (SSD) tailor-made for Network Attached Storage (NAS) systems to support rising demand for remote offices,..
NEC today announced the development of artificial intelligence (AI) technology that makes high-speed decisions while maintaining high accuracy in real-time analysis of time series data. The technology is based on brain activities..
Fujitsu and Hokkaido University today announced the development of a new technology based on the principle of explainable AI that automatically presents users with steps needed to achieve a desired outcome based..
A Japanese research group has developed a method that increases the accuracy of predicting long-term seawater temperatures by collecting data with the help of turtles. Researchers from the Japan Agency for Marine-Earth..
Samsung today announced that it has developed the industry’s first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung’s new innovation is considered one of the most challenging packaging technologies for mass production of..
