Epson has begun volume production of Epson’s first controller IC designed specifically for head-up displays -S2D13V40. Epson’s new controller enables rapid head-up display system development by offering the ability to correct the..
Tag Archives: IC
Samsung today announced the start of mass production of its first Exynos-branded Internet of Things (IoT) solution, the Exynos i T200. In terms of processing, the Exynos i T200 utilizes both a..
Toshiba today announced the launch of a 4-channel power amplifier IC -TCB502HQ that detects output offset voltage, a factor in speaker burnout. The new IC integrates a newly developed, full-time offset detection..
The new Samsung near field communication (NFC) chip S3FWRN5 features high radio frequency (RF) performance and small package size. The S3FWRN5’s RF performance doubles the range in both reader and card emulation..
Epson has begun shipping samples of the S1D13709, a new display controller IC with built-in memory that is capable of easily controlling the display of both text and graphics on color TFT..
Toshiba today announced that it has launched a 4 channel power amplifier IC-TB2941HQ that improves noise tolerance in audio systems in cars with engine idling reduction systems. Engines of cars with idling..
Fujitsu Semiconductor today announced the release of two new power management IC products developed to utilize energy harvesting, the MB39C811 DC/DC buck converter and the MB39C831 DC/DC boost converter. Energy harvesting is..
Mitsubishi Electric announced today it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances…
Fujitsu and Fujitsu Kyushu Network have commenced environmental CSR activities that support the Wild Bird Society of Japan’s study of Blakiston’s fish owl habitat in eastern Hokkaido in Japan. The Blakiston’s fish..
NEC has developed an ultra-thin, 0.3mm thick, organic radical battery (ORB) that is compatible within standard IC cards of 0.76mm thickness.The adoption of these ultra-thin ORBs featuring greater flexibility, higher power output..