Tag: IC

  • Epson Develops Controller IC S2D13V4 Specifically For High-Resolution Head-Up Displays

    Epson Develops Controller IC S2D13V4 Specifically For High-Resolution Head-Up Displays

    Epson has developed and begun shipping samples of the S2D13V42, a controller IC designed specifically for high-resolution head-up displays. Automotive head-up displays that can be recognized with minimal eye movement are increasingly being installed in vehicles to enhance safety and lessen fatigue, and demand for them is expected to continue to expand. Epson S2D13V42 controller…

  • Samsung Introduces Smart All-in-One Fingerprint Security IC for Biometric Payment

    Samsung Introduces Smart All-in-One Fingerprint Security IC for Biometric Payment

     Samsung today announced its new fingerprint security IC (integrated circuit) ─ S3B512C ─ with enhanced security features. Samsung S3B512C combines a fingerprint sensor, Secure Element (SE) and Secure Processor, adding an extra layer of authentication and security in payment cards. The new solution is EMVCo and Common Criteria Evaluation Assurance Level (CC EAL) 6+ certified…

  • Epson Begins Volume Production of Warping Correction controller IC for Head-Up Displays

    Epson Begins Volume Production of Warping Correction controller IC for Head-Up Displays

    Epson has begun volume production of Epson’s first controller IC designed specifically for head-up displays -S2D13V40. Epson’s new controller enables rapid head-up display system development by offering the ability to correct the distortion of images streamed from an SoC according to the curvature of a vehicle’s windshield, without external memory. The controller is equipped with…

  • Samsung starts mass production of its first Exynos-branded IoT Solution – Exynos i T200

    Samsung starts mass production of its first Exynos-branded IoT Solution – Exynos i T200

    Samsung today announced the start of mass production of its first Exynos-branded Internet of Things (IoT) solution, the Exynos i T200. In terms of processing, the Exynos i T200 utilizes both a Cortex-R4 processor and an additional Cortex-M0+ processor enabling the devices it supports to process and perform various tasks without the need for an…

  • Toshiba Car Audio Current-Feedback Power Amplifier IC Prevents Speaker Burnout

    Toshiba Car Audio Current-Feedback Power Amplifier IC Prevents Speaker Burnout

    Toshiba today announced the launch of a 4-channel power amplifier IC -TCB502HQ that detects output offset voltage, a factor in speaker burnout. The new IC integrates a newly developed, full-time offset detection circuit that detects output offset voltage even during sound reproduction, preventing speaker burnout.

  • Samsung NFC Chip S3FWRN5 Offers Increased RF Performance in a Small Package

    Samsung NFC Chip S3FWRN5 Offers Increased RF Performance in a Small Package

    The new Samsung near field communication (NFC) chip S3FWRN5 features high radio frequency (RF) performance and small package size. The S3FWRN5’s RF performance doubles the range in both reader and card emulation modes, when compared to that of its predecessor, the S3FNRN3. As the industry’s only NFC IC built using a 45nm e-Flash process, the…

  • Epson’s new display controller IC supports both text & graphics on color TFT and STN LCDs

    Epson’s new display controller IC supports both text & graphics on color TFT and STN LCDs

    Epson has begun shipping samples of the S1D13709, a new display controller IC with built-in memory that is capable of easily controlling the display of both text and graphics on color TFT and STN LCD panels. This display controller is ideal for control panels used on factory automation equipment and office equipment such as printers…

  • Toshiba launches new Power Amplifier IC for car audio

    Toshiba launches new Power Amplifier IC for car audio

    Toshiba today announced that it has launched a 4 channel power amplifier IC-TB2941HQ that improves noise tolerance in audio systems in cars with engine idling reduction systems. Engines of cars with idling reduction systems often cut out, causing battery voltage to drop. By reducing the minimum operation voltage from 8V to 6V, the new power…

  • Fujitsu announces two new energy harvesting power management IC Products

    Fujitsu announces two new energy harvesting power management IC Products

    Fujitsu Semiconductor today announced the release of two new power management IC products developed to utilize energy harvesting, the MB39C811 DC/DC buck converter and the MB39C831 DC/DC boost converter. Energy harvesting is the process of collecting, or harvesting, minute amounts of unharnessed energy from the surrounding environment, including light and vibration, and converting these to…

  • Mitsubishi Electric announces MOSFET-type Super-mini DIPIPM

    Mitsubishi Electric announces MOSFET-type Super-mini DIPIPM

    Mitsubishi Electric announced today it will launch a transfer-mold-type, super-mini dual inline package intelligent power module (DIPIPM) primarily used for inverter drive systems of small-capacity motors in refrigerators and other consumer appliances. The module uses a metal oxide semiconductor field effect transistor (MOSFET) switching device featuring low power-on voltage in low current regions.