SK Hynix today announced that it has developed its first DDR5 DRAM-based CXL (Compute Express Link) memory samples and strengthened its presence in next-generation memory solutions market. The form factor of the..
Tag Archives: memory
AMD today announced the Ryzen Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000..
Samsung today announced its development of the industry’s first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity..
GIGABYTE today announced the GIGABYTE Radeon RX 6400 EAGLE 4G and Radeon RX 6400 D6, low Profile 4G graphics cards engineered to deliver great 1080p gaming performance with remarkable efficiency. The cards..
SK hynix announced today that it has developed PIM, a next-generation memory chip with computing capabilities. PIM(Processing In Memory): A next-generation technology that provides a solution for data congestion issues for AI..
LG today unveiled its first gaming laptop 17G90Q, expanding its premium UltraGear lineup. A powerful performer with a seriously sleek design, the CES 2022 Innovation Award-winning laptop delivers sublime gaming experiences and..
Thermaltake today announced the launch of TOUGHRAM XG RGB – White DDR4 Memory, a new edition of the high-end TOUGHRAM XG RGB series. The new white series comes with frequencies up to..
Samsung today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM. Samsung’s LPDDR5X is a next-generation mobile DRAM designed to..
SK hynix today became the first in the industry to successfully develop the High Bandwidth Memory 3, the world’s best-performing DRAM. HBM3, the fourth generation of the HBM technology with a combination..
Samsung has begun mass producing from today its latest smartphone memory solution, the LPDDR5 UFS-based multichip package (uMCP). Samsung’s uMCP integrates the fastest LPDDR5 DRAM with the latest UFS 3.1 NAND flash,..
