Tag: Micron

  • Micron Technology ships first samples of Hybrid Memory Cube

    Micron Technology ships first samples of Hybrid Memory Cube

    Micron Technology announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples. HMC uses advanced through-silicon vias (TSVs)—vertical conduits that electrically connect a stack of individual chips—to combine high-performance logic with Micron’s state-of-the-art DRAM. Micron’s HMC features a 2GB memory cube that is composed of a stack of four 4Gb DRAM die.…