-
Micron Technology ships first samples of Hybrid Memory Cube
Micron Technology announced today that it is shipping 2GB Hybrid Memory Cube (HMC) engineering samples. HMC uses advanced through-silicon vias (TSVs)—vertical conduits that electrically connect a stack of individual chips—to combine high-performance logic with Micron’s state-of-the-art DRAM. Micron’s HMC features a 2GB memory cube that is composed of a stack of four 4Gb DRAM die.…