Samsung today announced that its 16-gigabit (Gb) DDR5 DRAM, which utilizes the industry’s most advanced 12 nanometer (nm)-class process technology, has started mass production. Compared to the previous generation, Samsung’s new 12nm-class..
Tag Archives: power
LG will unveil its 2023 soundbar lineup -new SC9 and SE6 models at CES 2023. The new LG soundbars are a perfect match for LG’s 2023 TV lineups, providing an effortless user..
Mitsubishi Power today announced that it will establish a Takasago Hydrogen Park, the world’s first center for validation of hydrogen-related technologies, from hydrogen production to power generation. The center will be co-located..
Thermaltake today announced the launch of the Toughpower GF1 650/750/850W Snow – TT Premium Edition. While delivering 80 PLUS Gold-certified efficiency, the new models of the Toughpower GF1 Gold series retains all..
The demand for the Internet of Things (IoT) is on the rise throughout society. Now, Ricoh’s flexible energy harvesting device efficiently generates power indoors or in shaded areas as a stand-alone power..
Samsung today announced the industry’s first integrated power management ICs (PMICs) — S2FPD01, S2FPD02 and S2FPC01, for the fifth-generation double data rate (DDR5) dual in-line memory module (DIMM). For improved performance efficiency..
Toyota announced today that it is developing a hydrogen engine. Combustion in hydrogen engines occurs at a faster rate than in gasoline engines, resulting in a characteristic of good responsiveness. While having..
Supply of Electricity in Times of Disaster Toyota and Honda will create a mobile power generation/output system, Moving e, that consists of a fuel cell bus that can carry a large amount..
Panasonic announced today that it has succeeded in demonstrating the world’s highest brightness blue laser. Panasonic achieved by using the wavelength beam combining (WBC) technology on a direct diode laser (DDL) to..
Mitsubishi Electric has developed the world’s first ultra-wideband transmission chip set with S/C/X-band capability, designed for multi-purpose wireless systems. The new chip set is expected to facilitate the downsizing of transmission modules..
