-
IBM unveils breakthrough software to Program SyNAPSE Chips
Scientists from IBM today unveiled a breakthrough software ecosystem designed for programming silicon chips that have an architecture inspired by the function, low power, and compact volume of the brain. The technology could enable a new generation of intelligent sensor networks that mimic the brain’s abilities for perception, action, and cognition.
-
Japan Hobby tool announces Silicon body cover for Canon EOS 6D
Japan Hobby tool today announced the sale of silicon body cover for Canon EOS 6D. The silicon cover is available in two colors-Blacks and Red. The Japan Hobby tool silicon body covers for Canon EOS 6D protects the camera from dust, dirt, shock etc. Screen protector and plastic LCD protection film is also included. The…
-
Fujitsu Develops Integrated Silicon Optical Transmitter to Carry Large Volumes of Data between CPUs
Fujitsu today announced the development of an integrated silicon optical transmitter for use in an optical transceiver, which is essential for enabling large volumes of data to be transmitted between CPUs. Thermal fluctuations from the heat emitted by CPUs have a large impact on both the light source built into optical transmitters located near CPUs…
-
Mitsubishi Electric Develops GaN Power Amplifier on Si Substrate for Mobile Communications Base Stations
Mitsubishi Electric announced today it has developed a prototype high-output, high-efficiency 2GHz power amplifier for mobile communications base stations. The amplifier features a gallium nitride (GaN) transistor on a silicon (Si) substrate instead of a more costly silicon carbide (SiC). Mitsubishi Electric’s new GaN power amplifier achieves a power conversion efficiency of 70% at 2.1GHz,…
-
Textured surface may boost power output of thin silicon solar cells
Highly purified silicon represents up to 40 percent of the overall costs of conventional solar-cell arrays — so researchers have long sought to maximize power output while minimizing silicon usage. Now, a team at MIT has found a new approach that could reduce the thickness of the silicon used by more than 90 percent while…
