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SK Hynix DRAM for AI applications HBM3E can process more than 230 Full-HD movies of 5GB-size each in a second!
SK hynix announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available. Customer’s evaluation of samples is underway. A high-value, high-performance memory that vertically interconnects multiple DRAM chips, enabling a dramatic increase in data processing speed in comparison to earlier DRAM products. HBM3E is the extended version…
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SK hynix Develops World’s Fastest Server Memory Module – DDR5 MCR DIMM
SK hynix has developed working samples of the world’s fastest server DRAM product – DDR5 Multiplexer Combined Ranks (MCR) Dual In-line Memory Module. The new MCR DIMM has been confirmed to operate at the data rate of minimum 8Gbps, and at least 80% faster than 4.8Gbps of the existing DDR5 products. SK hynix designed the…
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SK hynix develops its first DDR5 DRAM-based CXL sample
SK Hynix today announced that it has developed its first DDR5 DRAM-based CXL (Compute Express Link) memory samples and strengthened its presence in next-generation memory solutions market. The form factor of the sample is EDSFF (Enterprise & Data Center Standard Form Factor) E3.S and it supports PCIe 5.0 x8 Lane, uses DDR5 standard DRAM and…
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SK hynix develops next-generation memory chip with computing capabilities for AI
SK hynix announced today that it has developed PIM, a next-generation memory chip with computing capabilities. PIM(Processing In Memory): A next-generation technology that provides a solution for data congestion issues for AI and big data by adding computational functions to semiconductor memory. SK hynix plans to showcase its PIM development at the world’s most prestigious…
