SK hynix announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available. Customer’s evaluation of samples is underway. A high-value, high-performance memory that vertically..
SK hynix has developed working samples of the world’s fastest server DRAM product – DDR5 Multiplexer Combined Ranks (MCR) Dual In-line Memory Module. The new MCR DIMM has been confirmed to operate..
SK Hynix today announced that it has developed its first DDR5 DRAM-based CXL (Compute Express Link) memory samples and strengthened its presence in next-generation memory solutions market. The form factor of the..
SK hynix announced today that it has developed PIM, a next-generation memory chip with computing capabilities. PIM(Processing In Memory): A next-generation technology that provides a solution for data congestion issues for AI..
