Mitsubishi Electric announced today the launch of a new transfer molded power module (T-PM) mainly designed for hybrid and electric vehicle applications. The company’s J Series T-PM, whose lifespan is 30 times longer than that of industrial power modules and is completely lead-free, provides enhanced reliability by incorporating Mitsubishi Electric’s proprietary technology that ensures power loss reduction. Mitsubishi Electric’s J-Series T-PM offers enhanced reliability by incorporating the company’s original, inner connection technology called direct lead bonding (DLB). DLB reduces power loss through decreasing wiring resistance and inductance in modules by way of an extended main terminal that is sufficiently long to be bonded directly to the power chip. Power chips were previously connected to terminals by aluminum wire.
Sales will begin April 8, 2011.