NTT DoCoMO develops Low-Power LSI chip for forthcoming Super 3G mobile system

nttdocomo_chip.jpgNTT Do CoMo has successfully developed a trial large-scale-integration (LSI) chip that consumes less than 0.04 W of power yet supports multiple-input multiple-output signal detection and decoding for downlink transmissions at 100 Mbps, the speed required for the forthcoming mobile system known as Super 3G, or Long Term Evolution (LTE), approved by the 3rd Generation Partnership Project (3GPP). Compared with chips currently used in handsets compatible with DOCOMO’s High Speed Downlink Packet Access (HSDPA) service, which have a maximum downlink rate of 7.2 Mbps, the new chip will enable downlinks that are more than 10 times as fast. The chip also includes error correction decoding, which requires almost the same level of complexity as MIMO signal detection.

DOCOMO will incorporate its new LSI chip technology in ongoing research and development of LTE and International Mobile Telecommunications-Advanced (IMT-Advanced) systems, as well as in its active support of the establishment of related international standards.