Samsung first in the industry to start mass producing 32 GB memory modules using 30 nm class four gigabit DDR3 DRAM chips


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Samsung today announced that it is the first in the industry to start mass producing 32 gigabyte (GB) memory modules, essential for cloud computing and advanced server systems, using 30 nanometer (nm) class four gigabit (Gb) DDR3 DRAM chips. With its new 32GB registered dual inline memory module (RDIMM) and an 8GB small outline dual in-line memory module (SO-DIMM) added this month, Samsung has completed a full product line-up of 30nm-class 4Gb green DDR3-based solutions. Samsung’s 30nm-class 4Gb DDR3 chip offers an approximate 50 percent increase in productivity over a 40nm-class 4Gb DDR3, and as a result is expected to achieve rapid market penetration.


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By offering its new DDR3 modules shortly after providing 30nm-class 4Gb LPDDR2 DRAM, Samsung is now supporting the needs of the entire marketplace for 30nm-class DRAM solutions from mobile devices to enterprise server systems. Samsung’s new 1.35-volt 32GB RDIMM performs at up to 1,866 megabits per second (Mbps), achieving a 40 percent improvement over a 1,333 Mbps, 40nm-class 32GB RDIMM operating at 1.5 volts, therein consuming 18 percent less power.